Moving from

[kster59]

SPI flash availability seems to change every couple of months and we were forced to change from Winbond W25X10BV to M25P10 (made by Micron, stamped on the chip ST and XMOS lists manufacturer as Numonyx).

Do I need to change the AES boot module and XN file?

Previously we moved from the ATMEL AT25FS010 to the Winbond W25X10BV - again because the prior chip was EOL and no longer available. This required addition of:
fl_DeviceSpec myFlashDevices [] =
{
FL_DEVICE_ATMEL_AT25FS010,
FL_DEVICE_WINBOND_W25X10BV,
FL_DEVICE_NUMONYX_M25P10
};

However my XN file remained the same:

<ExternalDevices>
<Device NodeId="0" Core="0" Class="SPIFlash" Name="bootFlash" Type="AT25FS010">
<Attribute Name="PORT_SPI_MISO" Value="PORT_SPI_MISO"/>
<Attribute Name="PORT_SPI_SS" Value="PORT_SPI_SS"/>
<Attribute Name="PORT_SPI_CLK" Value="PORT_SPI_CLK"/>
<Attribute Name="PORT_SPI_MOSI" Value="PORT_SPI_MOSI"/>
</Device>
</ExternalDevices>

Changing to the WINBOND_W25X10BV didn't seem to make a difference but now with the NUMONYX_M25P10 I am seeing some flash write problems. Does the XN file need to be updated? Does the AES boot loader need to be recompiled with the NUMONYX_M25P10 chip?