XMOS has been "quietly" voicing concern over heat management issues with the XS1-G4 144 lately. In fact, we know of one company that was urged NOT to use the 144 and instead the use the 512 BGA on new designs.
What , if any issues, have other users encountered? How much of the processor are you using?
Also - is it possible to execute a 4 layer PCB design with the 512?
Heat issues with XS1-G4-144?
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It is possible for a 4 layer PCB, if all the IO are not used, you may be able to fit them all.
I will be using the 144 BGA's, but I will be sure to heatsink them well and keep other components clear of it. XMOS heat output does not change much on processing load, the idle heat is high.
I will be using the 144 BGA's, but I will be sure to heatsink them well and keep other components clear of it. XMOS heat output does not change much on processing load, the idle heat is high.
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Hi,
Does that mean the heat generation of a XS1-G4 is more or less
independent of its core loads ? It would be good to know,
since one case only had to be considered regarding heat
dissipation efforts.
I did not check all data sheets so far, but for an industrial environment
an extended temperature range of typically 85 deg operating temperature
plays also an important role.
Matrix
Does that mean the heat generation of a XS1-G4 is more or less
independent of its core loads ? It would be good to know,
since one case only had to be considered regarding heat
dissipation efforts.
I did not check all data sheets so far, but for an industrial environment
an extended temperature range of typically 85 deg operating temperature
plays also an important role.
Matrix
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I checked the XMOS document 'Estimating Power Consumption For XS1-G Devices'
It is a complex issue and bottom line is that chip power consumption might well
depend on the running application. So if one need to add a heat sink to the
chip is not dictated by ambient temperature and PCB alone.
Matrix
It is a complex issue and bottom line is that chip power consumption might well
depend on the running application. So if one need to add a heat sink to the
chip is not dictated by ambient temperature and PCB alone.
Matrix