Heat issues with XS1-G4-144?

Technical discussions around xCORE processors (e.g. xcore-200 & xcore.ai).
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tknesel
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Heat issues with XS1-G4-144?

Post by tknesel »

XMOS has been "quietly" voicing concern over heat management issues with the XS1-G4 144 lately. In fact, we know of one company that was urged NOT to use the 144 and instead the use the 512 BGA on new designs.

What , if any issues, have other users encountered? How much of the processor are you using?

Also - is it possible to execute a 4 layer PCB design with the 512?


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rp181
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Post by rp181 »

It is possible for a 4 layer PCB, if all the IO are not used, you may be able to fit them all.

I will be using the 144 BGA's, but I will be sure to heatsink them well and keep other components clear of it. XMOS heat output does not change much on processing load, the idle heat is high.
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matrix
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Post by matrix »

Hi,

Does that mean the heat generation of a XS1-G4 is more or less
independent of its core loads ? It would be good to know,
since one case only had to be considered regarding heat
dissipation efforts.

I did not check all data sheets so far, but for an industrial environment
an extended temperature range of typically 85 deg operating temperature
plays also an important role.

Matrix
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matrix
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Post by matrix »

I checked the XMOS document 'Estimating Power Consumption For XS1-G Devices'

It is a complex issue and bottom line is that chip power consumption might well
depend on the running application. So if one need to add a heat sink to the
chip is not dictated by ambient temperature and PCB alone.

Matrix
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